Epoxyset, Inc. - Encapsulants & Underfills for Micro Electronics 
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Encapsulants & Underfills for Micro Electronics

 
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larger image 		Epoxyset Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Glob top technology requires an encapsulant with a fine-tuned rheology, as the flow capabilities must allow the wires to be covered without the encapsulant flowing beyond the chip. Dam and fill technology, where the dam is used to limit the flow of the low viscosity fill material, allowing its use with fine pitch wire leads.

These encapsulants are thermal cure materials and are designed for the highest reliability in that they offer low coefficient of thermal expansion, high glass transition temperature, and low ionic content. These encapsulants have been engineered to provide protection to wire bonds, leads, aluminum and silicon dies from harsh environments, mechanical damage and corrosion.

These products offer excellent elevated temperature stability and thermal shock resistance, outstanding electrical insulation at room and elevated temperatures, minimal shrinkage and low stress during cure, as well as excellent chemical resistance.



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Item #

Description

Pot Life at 25ºC

Viscosity at 25ºC

Cure Schedule

Volume Resistivity at 25ºC

Shelf Life

M-21T Damming material for BGAs >8 hrs Paste 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-22T Damming material for BGAs >8 hrs Paste 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-22T-1 Tall dam version of M-22T-1 >8 hrs Paste 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-21 Encapsulant for dam & fill or cavity down BGAs >8 hrs 3000 - 4000 cps 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-22 Standard dam & fill material >8 hrs 30,000 - 40,000 cps 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-22LV Lower viscosity version of M-22 >8 hrs 15,000 - 20,000 cps 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-3030 Very low CTE & low stress for large packages >8 hrs 90,000 - 120,000 cps 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
M-3030LV-M Modified version of M-3030 for reflow oven temp (260ºC) >8 hrs 40,000 - 50,000 cps 1 hr at 80ºC +
2 hrs at 150ºC 		>1015 Ohm-cm 1 year at -40ºC
EB-350-1 Encapsulant for smart cards, COB and watch Ics, non-abrasive filler for grinding if necessary 3 months >120,000 cps 15-30 min at 150ºC >1015 Ohm-cm 3 months at 25ºC
EB-350-1LV Medium glob version of EB-350-1 >1 month 30,000 - 40,000 cps 15-30 min at 150ºC >1015 Ohm-cm 3 months at 10ºC
EB-350-1LV-M2 Lower glob version of EB-350-1 >1 month 15,000 - 20,000 cps 15-30 min at 150ºC >1015 Ohm-cm 3 months at 10ºC
EB-350-1-LE Low CTE version of EB-350-1 3 months 30,000 - 40,000 cps 15-30 min at 150ºC >1015 Ohm-cm 3 months at 10ºC
M-3110 Fast flow encapsulant for flip chip underfill application with a gap of 1 mil (25 micron) >24 hrs 5000 - 6000 cps 15-30 min at 150ºC >1015 Ohm-cm 1 year at -40ºC
M-3112 Medium flow encapsulant for gap of 3 mils (75 micron) >24 hrs 30,000 - 40,000 cps 15-30 min at 150ºC >1015 Ohm-cm 1 year at -40ºC
M-3116 Medium flow encapsulant for gap of 3 mils (75 micron) >24 hrs 14,000 - 18,000 cps 15-30 min at 150ºC >1015 Ohm-cm 1 year at -40ºC
M-3131 Medium flow encapsulant for gap of 3 mils (75 micron) >24 hrs 8000 - 10,000 cps 15-30 min at 150ºC >1015 Ohm-cm 1 year at -40ºC
  Results 1 - 16 of 16 1