Epoxyset, Inc. - Low Expansion Adhesives 
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Low Expansion Adhesives

 
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larger image 		Epoxyset - Low Thermal Expansion adhesives are specifically designed to provide maximum adhesion while maintaining a balance of other important properties such as pot life, cure time & temperature, low thermal expansion, Glass transition temperature, dielectric properties etc.

These high performance adhesives are used for bonding and sealing critical high technology applications. They are recommended for bonding metals that will be subjected to thermal shock and temperature ranges from -65ºC to 230ºC. The fully cured products provide excellent dielectric properties, and very good thermal shock & impact resistance. They also have good resistance to weather, water, most petroleum products, mild acids & alkalis, and many other chemicals. All adhesives meet NASA outgassing requirements.


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Item #

Pot Life at 25ºC

Mix Viscosity at 25ºC

Cure Schedule

CTE (Below Tg)

Service Temperature Range

Shelf Life at 25ºC

EB-301 1 hr Paste 2 hrs at 100ºC
24 hrs at 25ºC 		32 in/in/ºC -65 to 120 ºC 1 year
EB-347 1 hr 45,000 - 55,000 cP 2 hrs at 100ºC
24 hrs at 25ºC 		25 in/in/ºC -65 to 130 ºC 1 year
EB-347LV 1-2 hrs 30,000 - 45,000 cP 2 hrs at 100ºC
24 hrs at 25ºC 		25 in/in/ºC -65 to 130 ºC 1 year
EB-309 1-2 hrs Paste 2 hrs at 100ºC
24 hrs at 25ºC 		18 in/in/ºC -55 to 120 ºC 1 year
EB-315 2 hrs Paste 1 hr at 165ºC
2 hrs at 150ºC 		25 in/in/ºC -65 to 200 ºC 1 year
EB-348 2 hrs Paste 1 hr at 165ºC
2 hrs at 150ºC 		23 in/in/ºC -65 to 230 ºC 1 year
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