Epoxyset, Inc. - Die Attach Adhesives for Micro Electronics 
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Die Attach Adhesives for Micro Electronics

 
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larger image 		Epoxyset - Electrically & Thermally conductive adhesives are typically used for die-attach, chip bonding, cold - soldering, and other microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure for 1000 hours at 150ºC.



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Item #

Viscosity (CP-51 Spindle)

Cure Schedule

Die Shear Strength

Maximum Service Temperature

Pot Life

Shelf Life

EO-21 32,400 cps at 5 rpm 1 hr at 100ºC 2100 psi 125 ºC 1 hr at 25ºC 1 year at 25ºC
EO-24 2800 cps 5 minutes at 150ºC >1600 psi 200 ºC >2 days at 25ºC 1 year at 25ºC
EO-32 45,000 cps at 5 rpm 5 minutes at 150ºC >2000 psi 200 ºC >24 hrs at 25ºC 1 year at 25ºC
EO-81 12,000 cps at 5 rpm 1 hr at 180ºC >2500 psi 200 ºC >20 days at 25ºC 1 month at 25ºC
EO-83M-2 12,700 cps at 5 rpm 30 minutes at 150ºC >1600 psi 200 ºC >20 days at 25ºC 3 months at 0ºC
EO-84M-1T 49,000 cps at 5 rpm 1 hr at 150ºC >1600 psi 200 ºC >20 days at 25ºC 3 months at 0ºC
EO-97M2 47,000 cps at 5 rpm 5 min at 150ºC >2000 psi 200 ºC >7 days at 25ºC 4 months at 0ºC
EO-98HT 37,500 cps at 5 rpm 10-15 minutes at 150ºC >1200 psi 250 ºC >8 hrs at 25ºC 1 year at -40ºC
EB-316BN-2 Paste 2 hrs 80ºC >3000 psi 125 ºC 45 mins at 25ºC 1 year at 25ºC
EB-316-TC Paste 2 hrs 80ºC >3000 psi 125 ºC 45 mins at 25ºC 1 year at 25ºC
EB-402-1 >250,000 cps 1-2 hrs 125ºC >3000 psi 200 ºC 10 mins at 125ºC 1 year at -40ºC
EB-403-1LV 140,000 - 160,000 cps 30 min 150ºC >3500 psi 200 ºC 30 mins at 80ºC 3 months at 25ºC
EB-403-1AN >250,000 cps 30 min 150ºC >3500 psi 200 ºC 30 mins at 80ºC 3 months at 25ºC
EB-404-1 40,000 cps 30 min 150ºC >2800 psi 200 ºC 10 mins at 80ºC 3 months at 25ºC
EB-425 130,000 - 180,000 cps 1-2 hrs 150ºC >3400 psi 200 ºC >4 hrs at 25ºC 1 year at 25ºC
  Results 1 - 15 of 15 1