Epoxyset, Inc. - Urethane Potting & Encapsulating Compounds
Epoxy Resin | Adhesive | Conductive | Epoxy Set Est 1997
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Urethane Potting & Encapsulating Compounds
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Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
Applications:
Circuit Board Protection - Sensitive electronic components
Potting telecommunications equipment
Thermal cut-out switches
Potting ballasts, pumps, surge suppressors, connectors, switches, relays, coils, transformers, power supplies, resistors, solenoids, proximity switches, transistors, sensors, power line filters, timers, etc
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Item #
Color
Pot Life at 25ºC
Mix Viscosity at 25ºC
Cure Schedule
Service Temperature Range
Volume Resistivity
UC-2521
Beige
30 min
2000 - 4000 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
UC-2524
Black
60 - 90 min
1500 - 3000 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
UC-2209
Blue
30 - 60 min
5000 - 8000 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
UC-2356
Black
30 - 60 min
300 - 600 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
UC-2658
Beige
20 min
4000 - 6000 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
UC-052107-1
Black
8 - 10 min
5000 - 7000 cps
2 hrs at 80ºC
24-48 hrs at 25ºC
-40 to 120 ºC
10
14
Ohm-cm
Results 1 - 6 of 6
1