(6) These products are formulated with unique Poly-Synthetic Resins & have no oil migration to prevent component contamination. These proprietary formulations provide low bleed and evaporation with superior thermal performance.
Applications:
CPU to heat sink
Telecommunications hardware
Transistor, diodes, rectifiers, motor control and semiconductor devices
(6) Provides high temperature stability up to 360ºC - These products have excellent wetting properties and outstanding heat transfer capabilities. They will not harden, dry out or melt.
