(12) Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
(15) Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
(13) Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
(7) Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
(6) Epoxyset’s potting and encapsulating compounds are formulated for the demanding high performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements.
Our Flame retardant and High Thermal Conductivity products provide higher flame retardancy, increased high-voltage insulating characteristics and improved thermal management over currently available materials, significantly reducing the operating temperature of potted internal components - thus extending the life cycle of electrical devices.
