(16) Epoxyset Encapsulants are used to provide environmental protection and add mechanical strength to wire bonded devices. Glob top technology requires an encapsulant with a fine-tuned rheology, as the flow capabilities must allow the wires to be covered without the encapsulant flowing beyond the chip. Dam and fill technology, where the dam is used to limit the flow of the low viscosity fill material, allowing its use with fine pitch wire leads.
These encapsulants are thermal cure materials and are designed for the highest reliability in that they offer low coefficient of thermal expansion, high glass transition temperature, and low ionic content. These encapsulants have been engineered to provide protection to wire bonds, leads, ...
(15) Epoxyset - Electrically & Thermally conductive adhesives are typically used for die-attach, chip bonding, cold - soldering, and other microelectronic applications. All products feature very high purity, low ionic content, wide operating temperature range and excellent electrical conductivity even after exposure for 1000 hours at 150ºC.
