(6) Unique formulations provide particle contact using selected size and shape of fillers. They provide excellent electrical & high thermal conductivity.
(2) Our TCP (Thermally Conductive Putty) are Non-Silicone based highly viscous putty. Naturally tacky, Non-Flowable, Non-Curable material heavily filled with heat-conductive metal oxides and proprietary binders. These combinations provide high thermal conductivity, low bleed, high temperature stability and no contamination properties.
These products are cost effective high performance Form in-Place, Thermally Conductive Gap filler putty. The highly thixotropic and highly conformable nature of the material allow to fill in air gaps between heat generating devices and heat sinks or metal chassis with rough surfaces and high stack up tolerances.
