(16) Epoxyset offers a full range of electrically conductive epoxy adhesives for the semiconductor, optoelectronic, automotive, aerospace and electronic assembly industries. Our wide range product line allows engineers to select material with the best combinations of physical, electrical and thermal characteristics. Our products provide low volume resistivity, very good electrical stability, low out-gassing, long pot life and fast cure.
(17) Our optical adhesives are used for bonding and coatings in various fiber optic applications. These adhesives are frequently used to bundle optical fibers and bond components in optoelectronic devices used for telecommunication networks, aircraft, and satellites, medical and scientific instruments.
(10) Epoxyset - High Temperature Adhesives are designed for high performance applications in electronics/microelectronics and other industries. They cure fast at moderately elevated temperatures. The cured systems provide excellent bond to metals such as ferrite and beryllium and retain the bond strength even at higher temperatures.
The fully cured products have excellent dielectric properties, and very good thermal shock & impact resistance. They also have good resistance to weather, water, most petroleum products, mild acids & alkalis, and many other chemicals.
(11) Our Fast Cure Adhesives are two-components, low viscosity or thixotropic, polyamine or polymercaptan cured, epoxy adhesives. It is specially designed for bonding golf club heads to shafts and develops excellent shear strength very quickly. It also exhibits good flexibility due to its semi-rigid cure. It bonds to most substrates including metal, wood, ceramics and several thermoplastics. These systems have very convenient mix ratio of 1:1 or 2:1 by weight and volume.
(17) These Medical Device adhesives are clear, two-part resin systems, which combines good handling characteristics with excellent cured properties. Their low viscosity allows good flow-ability and air release.
The cured adhesives has excellent bond to metals, ceramics, and many plastics used in Medical Industries such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
They are used on endoscopes, catheters, blood heat exchangers, syringes, and dental, surgical and orthopedic handheld, powered instruments.
(6) Epoxyset - Low Thermal Expansion adhesives are specifically designed to provide maximum adhesion while maintaining a balance of other important properties such as pot life, cure time & temperature, low thermal expansion, Glass transition temperature, dielectric properties etc.
These high performance adhesives are used for bonding and sealing critical high technology applications. They are recommended for bonding metals that will be subjected to thermal shock and temperature ranges from -65ºC to 230ºC. The fully cured products provide excellent dielectric properties, and very good thermal shock & impact resistance. They also have good resistance to weather, water, most petroleum products, mild acids & alkalis, and many ...
